trinamiX PbS infrared sensor single bare chip
The PbS infrared sensor that adopts trinamiX's thin-film encapsulation technology achieves excellent stability even in a thin bare chip.
The PbS infrared sensor, utilizing trinamiX's thin-film encapsulation technology, achieves excellent stability even in a thin bare chip. It is less affected by environmental factors such as moisture and oxygen, which helps suppress degradation. The size and shape of the bare chip are highly suitable for automated assembly, allowing for miniaturization of many application products and contributing to reduced assembly costs. The standard light-receiving area dimensions of the bare chip range from 0.5x0.5mm² to a maximum of 10x10mm².
- Company：アイ・アール・システム
- Price：Other
